A large selection of heat sinks are
available from high density, deep finned sections
to bonded fin constructions.
GCS utilizes CFD modelling and years of combined
industry expertise from our thermal and mechanical
designers. We provide optimization of product
in the specific application taking into account
all parameters which will influence the product
design. The sooner our involvement in the design
the more innovation and cost effectiveness we
can add to your product.
We look at creating our own heat sinks with
low thermal resistance and optimized air pressure
for force air applications. This has enabled
us to produce a range of heat sinks which have
maximum performance whilst maintaining cost
effectiveness. 80% of the heat sinks we supply
are custom built to specification. We provide
a comprehensive range of products ranging from
extrusion through to vacuum brazed products.
Let us be your thermal design partner.
For volume applications we can provide high
quality, high density die cast aluminium heat
sinks. We have great expertise in helping in
cost reduction for casting purpose and ensure
that the design is reliable in casting with
mould analysis tools provided prior to building
the mould. This helps us to identify any issues
in the design and any extra complications in
casting that we would work with you to overcome.
We are focused on giving you the best, open
and transparent support to engineering a cost
A comprehensive range of heat sinks are available
to suit LED applications from linear extrusions
to circular heat sinks for up/down lighter applications.
High density, Magnesium and Aluminium heat sinks
are also available.
As each application is different please contact
us for advice.
Gap fillers are used when a requirement
exists to thermally couple a hot Semiconductor
to a nearby cold wall or heat sink
This is done by filling the air gap above the
device and providing a thermally conductive path
for the heat to travel. Our gap filler materials
are unique in that they provide electrical isolation
and are very soft to assist with interfacial thermal
resistance as well as create low pressure forces
on the device during operation. Typical applications
include coupling hot FR4 pcb’s to chassis for
instance; LED arrays. Other applications include
cooling DSP (Digital Signal Processing) in computer
applications & power devices in PSU's or power
Typically an air gap of greater than 0.5mm (0.020”)
between the device and heat sink often means a
Gap Filler should be used. Uneven surfaces or
components at different heights would also be
an ideal area where under compression contact
can be made to assist heat flow to or from a package.
Two types of Gap Filling materials are available,
our pad types can be pre-punched into a required
shape for placement in the interface. Or our putty
type which can be squeezed into position by syringe
between a hot device and heat sink.
All gap-filling products are ROHS compliant.
Gap pad products are available in thicknesses
starting from 0.5mm to 6mm in 0.5mm increments
GCS thermal interface materials
are designed specifically for high performance
heat transfer. Our materials scientists
can rapidly develop and mix the material
formulas for volume custom applications.
The parts need to be mounted together
under mechanical pressure to assure the
soft nature of the material “cold flows”
into the micro-air voids and thermally
couples the two surfaces. Generally medium
to high mounting pressure is preferred
i.e. by screwing the surfaces together.
This to an optimum pressure after which
further pressure does not effect the performance
at the interface. At that given pressure
the air voids are filled.
GCS thermal interface materials are low
cost and ultra high performance for metal
to metal applications requiring no electrical
isolation to mount Insulated Metal circuits
to a further heat sink.
Thermoelectric modules or Peltier
Devices are a solid state “heat pump”
capable of moving undesirable heat or
to assist active cooling below ambient
where conventional refrigeration is expensive
or to bulky.
As the thermoelectric performance continues
to improve market opportunities and chances
to innovate are ever increasing.
GCS offers a range of the world’s highest
performing commercially available thermoelectric
material devices capable of transferring
heat in a dynamic way from one surface
to another by use of electric energy.
Traditional refrigeration systems are
a hazard to the environment, and with
increasing pressurized systems are occurring
leaks. When gases are released into the
atmosphere the ozone layer is depleted.
Peltier devices are not a serious hazard
to the environment as no harmful gases
Peltier devices are rugged and resist
shock, vibration and other loads without
the risk of fluid leakage. The Peltier
does not require service or maintainenance
unlike conventional wet cooling systems.
GCS is working on innovative technologies
and methods to bring nanotechnology based
thermoelectric products into reality.
This will increase the market opportunity
and share for thermoelectric products
If you have an active cooling requirement,
whether low volume or high volume domestic
or commercial, or maybe even a temperature
stabilization project we would be pleased
to hear from you so that our R&D efforts
can continue to focus on the changing
needs of the market.