A large selection of heat sinks are available from high density, deep finned sections to bonded fin constructions.

GCS utilizes CFD modelling and years of combined industry expertise from our thermal and mechanical designers. We provide optimization of product in the specific application taking into account all parameters which will influence the product design. The sooner our involvement in the design the more innovation and cost effectiveness we can add to your product.

We look at creating our own heat sinks with low thermal resistance and optimized air pressure for force air applications. This has enabled us to produce a range of heat sinks which have maximum performance whilst maintaining cost effectiveness. 80% of the heat sinks we supply are custom built to specification. We provide a comprehensive range of products ranging from extrusion through to vacuum brazed products. Let us be your thermal design partner.

For volume applications we can provide high quality, high density die cast aluminium heat sinks. We have great expertise in helping in cost reduction for casting purpose and ensure that the design is reliable in casting with mould analysis tools provided prior to building the mould. This helps us to identify any issues in the design and any extra complications in casting that we would work with you to overcome. We are focused on giving you the best, open and transparent support to engineering a cost effective solution.

A comprehensive range of heat sinks are available to suit LED applications from linear extrusions to circular heat sinks for up/down lighter applications.

High density, Magnesium and Aluminium heat sinks are also available.

As each application is different please contact us for advice.

Gap fillers are used when a requirement exists to thermally couple a hot Semiconductor to a nearby cold wall or heat sink

This is done by filling the air gap above the device and providing a thermally conductive path for the heat to travel. Our gap filler materials are unique in that they provide electrical isolation and are very soft to assist with interfacial thermal resistance as well as create low pressure forces on the device during operation. Typical applications include coupling hot FR4 pcb’s to chassis for instance; LED arrays. Other applications include cooling DSP (Digital Signal Processing) in computer applications & power devices in PSU's or power converters.

Typically an air gap of greater than 0.5mm (0.020”) between the device and heat sink often means a Gap Filler should be used. Uneven surfaces or components at different heights would also be an ideal area where under compression contact can be made to assist heat flow to or from a package.

Two types of Gap Filling materials are available, our pad types can be pre-punched into a required shape for placement in the interface. Or our putty type which can be squeezed into position by syringe between a hot device and heat sink.

All gap-filling products are ROHS compliant.

Gap pad products are available in thicknesses starting from 0.5mm to 6mm in 0.5mm increments

GCS thermal interface materials are designed specifically for high performance heat transfer. Our materials scientists can rapidly develop and mix the material formulas for volume custom applications.

The parts need to be mounted together under mechanical pressure to assure the soft nature of the material “cold flows” into the micro-air voids and thermally couples the two surfaces. Generally medium to high mounting pressure is preferred i.e. by screwing the surfaces together. This to an optimum pressure after which further pressure does not effect the performance at the interface. At that given pressure the air voids are filled.

GCS thermal interface materials are low cost and ultra high performance for metal to metal applications requiring no electrical isolation to mount Insulated Metal circuits to a further heat sink.

Thermoelectric modules or Peltier Devices are a solid state “heat pump” capable of moving undesirable heat or to assist active cooling below ambient where conventional refrigeration is expensive or to bulky.

As the thermoelectric performance continues to improve market opportunities and chances to innovate are ever increasing.

GCS offers a range of the world’s highest performing commercially available thermoelectric material devices capable of transferring heat in a dynamic way from one surface to another by use of electric energy.

Traditional refrigeration systems are a hazard to the environment, and with increasing pressurized systems are occurring leaks. When gases are released into the atmosphere the ozone layer is depleted. Peltier devices are not a serious hazard to the environment as no harmful gases are present.
Peltier devices are rugged and resist shock, vibration and other loads without the risk of fluid leakage. The Peltier does not require service or maintainenance unlike conventional wet cooling systems.

GCS is working on innovative technologies and methods to bring nanotechnology based thermoelectric products into reality. This will increase the market opportunity and share for thermoelectric products and assemblies.

If you have an active cooling requirement, whether low volume or high volume domestic or commercial, or maybe even a temperature stabilization project we would be pleased to hear from you so that our R&D efforts can continue to focus on the changing needs of the market.

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